vishay semiconductors VLMPG31L1M2 document number 81653 rev. 1.0, 28-feb-07 www.vishay.com 1 standard smd led plcc-2 features ? lead (pb)-free device ? smd leds with exceptional brightness ? luminous intensity categorized ? compatible with automatic placement equipment ? eia and ice standard package ? compatible with ir reflow, vapor phase and wave solder processes according to cecc 00802 and j-std-020c ? available in 8 mm tape ? low profile package ? non-diffused lens: exce llent for coupling to light pipes and backlighting ? low power consumption ? luminous intensity ratio in one packaging unit i vmax /i vmin 1.6 ? preconditioning: a cc. to jedec level 2a ? esd-withstand voltage: up to 2 kv according to jesd22-a114-b ? component in accordance to rohs 2002/95/ec and weee 2002/96/ec ? automotive qualified aec-q101 94 8 553 e3 description this device has been designed to meet the increasing demand for surface mounting technology. the package of the vlmpg31-series is the plcc-2. it consists of a lead frame which is embedded in a white thermoplast. the reflector inside this package is filled up with clear epoxy. product group and package data ? product group: led ? package: smd plcc-2 ? product series: standard ? angle of half intensity: 60 applications ? automotive: backlighting in dashboards and switches ? telecommunication: indicator and backlighting in telephone and fax ? indicator and backlight for audio and video equipment ? indicator and backlight in office equipment ? flat backlight for lcds , switches and symbols ? general use parts table part color, luminous intensity technology VLMPG31L1M2-gs08 pure green, i v = (11.2 to 28) mcd ailngap on gaas VLMPG31L1M2-gs18 pure green, i v = (11.2 to 28) mcd ailngap on gaas
www.vishay.com 2 document number 81653 rev. 1.0, 28-feb-07 vishay semiconductors VLMPG31L1M2 note: 1) t amb = 25 c, unless otherwise specified 2) driving led in reverse direction is suitable fo r short term application. note: 1) t amb = 25 c, unless otherwise specified 2) in one packing unit i vmax /i vmin 1.6 note: luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of 11 %. the above type numbers represent the order groups which include only a few brightness groups. only one group will be shipped on each reel (there will be no mixing of two groups on each reel). in order to ensure availability, si ngle brightness groups will not be orderable. in a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. in order to ensure availability, single wavelength groups will not be orderable. note: wavelengths are tested at a current pulse duration of 25 ms and an accuracy of 1 nm. absolute maximum ratings 1) VLMPG31L1M2 parameter test condition symbol value unit reverse voltage 2) v r 5v dc forward current t amb 85 c i f 30 ma surge forward current t p 10 s i fsm 0.2 a power dissipation p v 80 mw junction temperature t j 125 c operating temperature range t amb - 40 to + 100 c storage temperature range t stg - 40 to + 100 c thermal resistance junction/ ambient mounted on pc board (pad size > 16 mm 2 ) r thja 400 k/w optical and electrical characteristics 1) VLMPG31L1M2, pure green parameter test condition part symbol min typ. max unit luminous intensity 2) i f = 20 ma VLMPG31L1M2 i v 11.2 28 mcd dominant wavelength i f = 20 ma d 555 565 nm peak wavelength i f = 20 ma p 565 nm angle of half intensity i f = 20 ma ? 60 deg forward voltage i f = 20 ma v f 2.0 2.6 v reverse voltage i r = 10 a v r 5v luminous intensity classification group light intensity (mcd) standard optional min max l 1 11.2 14.0 2 14.0 18.0 m 1 18.0 22.4 2 22.4 28.0 color classification group dominant wavelength (nm) pure green min max 0 555 559 1 558 561 2 560 563 3 562 565
document number 81653 rev. 1.0, 28-feb-07 www.vishay.com 3 vishay semiconductors VLMPG31L1M2 typical characteristics t amb = 25 c, unless otherwise specified figure 1. forward current vs. ambient temperature figure 2. rel. luminous intensity vs. angular displacement figure 3. relative luminous intensity vs. wavelength 0 5 10 15 20 25 30 35 40 0 10203040506070 8 0 90 100 t am b - am b ient temperat u re (c) 16615 i f - for w ard c u rrent (ma) 0.4 0.2 0 0.2 0.4 0.6 95 10319 0.6 0.9 0. 8 0 30 10 20 40 50 60 70 8 0 0.7 1.0 i v rel - relati v e l u mino u s intensity 0.0 0.2 0.4 0.6 0. 8 1.0 1 . 2 510 530 550 570 590 610 1 8 64 8 p u re green i v rel - relati v e l u mino u s intensity - w a v elen g th (nm) figure 4. forward current vs. forward voltage figure 5. rel. luminous intens ity vs. ambient temperature 1 10 100 1.0 1.5 2.0 2.5 3.0 v f - for w ard v oltage ( v ) 95 10 8 7 8 i f - for w ard c u rrent (ma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 - 50 - 25 0 25 50 75 100 t am b - am b ient temperat u re (c) 1 8 616 i v rel - relati v e l u mino u s intensity p u re green
www.vishay.com 4 document number 81653 rev. 1.0, 28-feb-07 vishay semiconductors VLMPG31L1M2 package dimensions in millimeters 20541 mounting pad layout 1.2 2.6 (2. 8 ) 1.6 (1.9) 4 4 area co v ered w ith solder resist
document number 81653 rev. 1.0, 28-feb-07 www.vishay.com 5 vishay semiconductors VLMPG31L1M2 method of taping/polarity and tape and reel smd led (vlm3 - series) vishay?s leds in smd pack ages are available in an antistatic 8 mm blister tape (in accordance with din iec 40 (co) 564) for automatic component insertion. the blister tape is a plastic strip with impressed component cavities, covered by a top tape. taping of vlm.3.. reel package dimension in mm for smd leds, tape option gs08 (= 1500 pcs.) reel package dimension in mm for smd leds, tape option gs18 (= 8000 pcs.) preferred soldering profile figure 6. tape dimensions in mm for plcc-2 figure 7. reel dimensions - gs08 adhesi v e t ape component ca v ity blister t ape 94 8 670 1. 8 5 1.65 4.0 3.6 3.6 3.4 2.05 1.95 1.6 1.4 4.1 3.9 4.1 3.9 5.75 5.25 8 .3 7.7 3.5 3.1 2.2 2.0 0.25 94 8 66 8 1 8 0 17 8 identification 4.5 3.5 2.5 1.5 13.00 12.75 63.5 60.5 14.4 max. 10.0 9.0 120 94 8 665 la b el: v ishay type gro u p tape code prod u ction code q u antity figure 8. reel dimensions - gs18 figure 9. vishay lead (pb)-free reflow soldering profile (acc. to j-std-020c) figure 10. double wwave soldering of opto devices (all packages) 321 329 identification 4.5 3.5 2.5 1.5 13.00 12.75 62.5 60.0 14.4 max. 10.4 8 .4 120 1 88 57 la b el: v ishay type gro u p tape code prod u ction code q u antity 0 50 100 150 200 250 300 0 50 100 150 200 250 300 time (s) temperat u re (c) 240 c 245 c max. 260 c max. 120 s max. 100 s 217 c max. 30 s max. ramp u p 3 c/s max. ramp do w n 6 c/s 19 88 5 ir reflo w soldering profile for lead (p b )-free soldering preconditioning acc. to jedec le v el 2a max. 2 cycles allo w ed 255 c 235 c...260 c 2 k/s ca. 200 k/s ca. 2 k/s second w a v e first w a v e ca. 5 k/s 5 s f u ll line: typical dotted line: process limits time (s) temperat u re (c) lead tem perat u re 300 250 200 150 100 50 0 0 100 150 200 250 94 8 626-1 tt w soldering (acc. to cecc00 8 02) 50 100 c...130 c forced cooling
www.vishay.com 6 document number 81653 rev. 1.0, 28-feb-07 vishay semiconductors VLMPG31L1M2 bar code product label example: a) type of component b) manufacturing plant c) sel - selection code (bin): e.g.: k1 = code for luminous intensity group 4 = code for color group d) date code year/week e) day code (e.g. 2: tuesday) f) batch no. g) total quantity h) company code dry packing the reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. final packing the sealed reel is packed into a cardboard box. a secondary cardboard box is used for shipping purposes. recommended method of storage dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. the following conditions should be observed, if dry boxes are not available: ? storage temperature 10 c to 30 c ? storage humidity 60 % rh max. after more than 672 h under these conditions moisture content will be too high for reflow soldering. in case of moistu re absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 c + 5 c/- 0 c and < 5 % rh (dry air/ nitrogen) or 96 h at 60 c + 5 c and < 5 % rh for all device containers or 24 h at 100 c + 5 c not suitable for reel or tubes. an eia jedec standard jesd22-a112 level 2a label is included on all dry bags. example of jesd22-a112 level 2a label esd precaution proper storage and handling procedures should be followed to prevent esd damage to the devices especially when they are removed from the antistatic shielding bag. electro-static sensitive devices warning labels are on the packaging. vishay semiconductors standard bar code labels the vishay semiconductors standard bar code labels are printed at final packing areas. the labels are on each packing unit and contain vishay semiconductors specific data. 106 37 v ishay a h bc d e f g 197 88 al u min u m b ag la b el reel 15973 l e v e l caution this bag contains moisture ? sensitive devices 1. shelf life in sealed bag 12 months at <40c and < 90% relative humidity (rh) 2. after this bag is opened devices that will be subjected to infrared reflow, vapor - phase reflow, or equivalent processing (peak package body temp. 260c) must be: a) mounted within 672 hours at factory condition of < 30c/60%rh or b) stored at <1 0% rh. 3. devices require baking before mounting if: a) humidity indicator card is >10% when read at 23c + 5c or b) 2a or 2b is not met. 4. if baking is required, devices may be baked for: 192 hours at 40c + 5c/ - 0c and <5%rh (dry air/nitrogen) or 96 hours at 605 o cand <5%rh for all device containers or 24 hours at 1005c not suitable for reels or tubes bag seal date: ______________________________ (if blank, see bar code label) note: level defined by eia jedec standard jesd22 - a113 2a 197 8 6
document number 81653 rev. 1.0, 28-feb-07 www.vishay.com 7 vishay semiconductors VLMPG31L1M2 ozone depleting substa nces policy statement it is the policy of vishay semiconductor gmbh to 1. meet all present and future national and international statutory requirements. 2. regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. it is particular concern to control or eliminate releases of those substances into t he atmosphere which are known as ozone depleting substances (odss). the montreal protocol (1987) and its london amendments (1990) intend to severely restrict the use of odss and forbid their use within the next ten years. various national and international initiatives are pressing for an earlier ban on these substances. vishay semiconductor gmbh has been able to use its polic y of continuous improvements to eliminate the use of odss listed in the following documents. 1. annex a, b and list of transitional substances of the montreal protocol and the london amendments respectively 2. class i and ii ozone depleting substances in the clean air act amendments of 1990 by the environmental protection agency (epa) in the usa 3. council decision 88/540/eec and 91/690/eec annex a, b and c (transitional substances) respectively. vishay semiconductor gmbh can certify that our semico nductors are not manufactured with ozone depleting substances and do not contain such substances. we reserve the right to make changes to improve technical design and may do so without further notice. parameters can vary in different applications. all ope rating parameters must be validated for each customer application by the customer. should the buyer use vi shay semiconductors products for any unintended or unauthorized application, the buyer shall indemnify vishay semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indi rectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. vishay semiconductor gmbh, p.o.b. 3535, d-74025 heilbronn, germany
document number: 91000 www.vishay.com revision: 18-jul-08 1 disclaimer legal disclaimer notice vishay all product specifications and data are subject to change without notice. vishay intertechnology, inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, ?vishay?), disclaim any and all liability fo r any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. vishay disclaims any and all li ability arising out of the use or application of any product describ ed herein or of any information provided herein to the maximum extent permit ted by law. the product specifications do not expand or otherwise modify vishay?s terms and conditions of purcha se, including but not limited to the warranty expressed therein, which apply to these products. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of vishay. the products shown herein are not designed for use in medi cal, life-saving, or life-sustaining applications unless otherwise expressly indicated. customers using or selling vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify vishay for any damages arising or resulting from such use or sale. please contact authorized vishay personnel to obtain written terms and conditions regarding products designed for such applications. product names and markings noted herein may be trademarks of their respective owners.
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